发明名称 |
Method of forming a (200)-oriented platinum layer |
摘要 |
A method of depositing a (200)-oriented platinum thin film on a substrate, including the steps of forming a oxygen containing platinum layer on the surface of a silicon wafer heated to a temperature range over room temperature and not exceeding 700° C. under a mixed gaseous atmosphere of oxygen and inert gas and annealing the substrate at a temperature between 400° C. and 1000° C. The platinum thin film formed according to the present invention in (200)-oriented and does not have any conventional defects such as hillocks or voids.
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申请公布号 |
US6312567(B1) |
申请公布日期 |
2001.11.06 |
申请号 |
US19990320797 |
申请日期 |
1999.05.27 |
申请人 |
TONG YANG CEMENT CORPORATION |
发明人 |
LEE DONG SU;CHUN DONG IL;PARK DONG YEON;YOON EUI JOON;KIM MIN HONG;WOO HYUN JUNG;PARK TAE SOON |
分类号 |
C23C14/18;C23C14/58;H01L21/02;H01L21/285;(IPC1-7):C23C14/34 |
主分类号 |
C23C14/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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