SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

摘要

PURPOSE: To provide a low-priced semiconductor device having the high integration and the high reliability. CONSTITUTION: This semiconductor device has a substrate 1 containing a first region MC and a second region PC in a periphery thereof; an insulation film 21 formed on the second region PC; electrodes (17, 23) formed on a surface of the substrate 1 within the first region MC; a dielectric film 31 formed on the electrodes (17, 23); and an opposite electrode 35 formed on the dielectric film 31. A shape of a sidewall of the insulation film 21 contains a part reflecting a shape of an outer periphery of the sidewall of the opposite electrodes (17, 23).