| 摘要 |
PROBLEM TO BE SOLVED: To obtain a highly reliable electrode structure for soldering which enables chips of the same kind to be soldered to the same position without changing the wiring pattern of a printed board. SOLUTION: In this electrode structure for soldering in which a rectangular plate-like surface mounting parts are mounted on the printed board 4, soldering lands have first land step sections 61 having nearly the same width as first surface mounting parts 1 have, and second land step sections 62 having nearly the same width as second surface mounting parts 2 having a width broader than that of the first surface mounting parts 1 have. The lands are formed so that the first and second surface mounting parts 1 and 2 may be mounted on the printed board 4 while the center points S of the parts 1 and 2 are made to nearly coincide with each other. |
