发明名称 EQUIPMENT AND METHOD FOR HEAT TREATMENT
摘要 PROBLEM TO BE SOLVED: To provide equipment and method for heat treatment by which the temperature of an object to be treated can be raised and lowered at high speeds with relatively small power consumption. SOLUTION: The thermal treatment equipment has a treatment chamber, in which prescribed heat treatment is performed on the object to be treated, a heat source which heats the object from the first surface of the object, and a cooling mechanism which cools the object from the second surface of the object opposite to the first surface. The equipment also has a moving mechanism, which moves the object and cooling mechanism relatively to each other. Since the thermal treatment equipment is constituted to change the relative distance between the cooling mechanism and object, the distance between the cooling mechanism and object can be adjusted, so that efficiency is improved at heating and cooling.
申请公布号 JP2001308023(A) 申请公布日期 2001.11.02
申请号 JP20000121611 申请日期 2000.04.21
申请人 TOKYO ELECTRON LTD 发明人 KITAMURA MASAYUKI
分类号 C23C16/44;H01L21/00;H01L21/205;H01L21/26;(IPC1-7):H01L21/26 主分类号 C23C16/44
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