| 摘要 |
PROBLEM TO BE SOLVED: To provide a graphic accelerator by which a mounting area can be reduced and the process speed can be increased. SOLUTION: An accelerator chip 11 is mounted on the outside substrate (graphic board) 13 and further thereupon a VRAM chip 12 is mounted via pads 14, 16. The pad 14 is connected to a chip die 17 within the accelerator chip 11 via an internal wiring 15, a pad 16 is connected to a lead 19 via the internal wiring 18, and the lead 19 is connected to a bonding pad 20.
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