发明名称 ORGANIC MATTER REMOVING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND ORGANIC MATTER REMOVER AND SYSTEM
摘要 PROBLEM TO BE SOLVED: To remove a resist layer from a substrate to suppress the substrate exposed from the resist layer from corrosion. SOLUTION: The system comprises a container 1 made of stainless steel, etc., for defining a reactor chamber, exhaust hole 2 for exhausting the container 1, heater 4 for heating a substrate 3 mounted on a means for supporting a semiconductor substrate, etc., gas inlet pipe 5 for introducing a gas into the container 1, dielectric window 6 for isolating the interior of the container but allowing a high frequency power to pass through, and high frequency power feeder 7 for feeding a high-frequency power such as microwave power.
申请公布号 JP2001308078(A) 申请公布日期 2001.11.02
申请号 JP20010035569 申请日期 2001.02.13
申请人 CANON INC 发明人 ISHIHARA SHIGENORI
分类号 G03F7/42;H01L21/027;H01L21/302;H01L21/3065;(IPC1-7):H01L21/306 主分类号 G03F7/42
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