| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device that has a three-dimensional mounting modular structure by using a flexible circuit substrate that is superior in the ease of a three-dimensional assembly and repair (or rework) workability. SOLUTION: In mounting regions 111, 112, 113 of a flexible circuit substrate 11, mainly electronic components 121, 122, 123 are mounted respectively and other electronic components 124, 125 are also mounted. The flexible circuit substrate 11 has a structure wherein each of mounting regions 111-113 is folded up above a base region 110 in a given order (f1-f3). An integrated spacer 13 has a thick region 131 and a thin region 132 and is overlapped and adhered to the flexible circuit substrate 11 as shown by broken line arrows and supports the laminated layer of each of electronic components 121-125. To easily determine positions, a fastening boss 134 and an opening part 14 to fit it in are provided. |
