PHOTOSENSOR CHIP ASSEMBLY AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a photosensor chip assembly that minimizes refraction of light and a method of manufacturing the same. SOLUTION: This photosensor chip assembly 30 includes a substrate 40 provided with a printed circuit on its top surface 42; a photosensor chip 50 whose bottom surface is laminated on the top surface 42 of the substrate 40, whose top surface is provided with a sensing area 54 formed of a few photosensors 52 and a few electrically connected pads 56, and which is electrically connected to the printed circuit on the substrate 40 by the electrically connected pads 56; an electrically insulating protection layer 60 covering a portion where the photosensor chip 50 and the substrate 40 are electrically connected; and a transmissve hard protection layer 70 laminated so as to cover the sensing area 54 of the photosensor chip 50. The transmissive hard protection layer 70 is formed by treating a transparent photosensitive hard coating material applied on the top surface of the photosensor chip 50 by a photoengraving process and covers the top of the sensing area 54.