| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip-positioning device and method that can inhibit the generation of a flaw on the backside of a chip. SOLUTION: In this chip-positioning method, this chip-positioning device is used, where the chip-positioning device is equipped with a stage 19 whose surface is set to satin finish, a positioning control nib 17 that positions the chip, and driving means 12 and 13 that move the positioning control nib 17. The method includes a process that places the chip while vacuum check is being carried out on the stage 19, and a process that turns off the vacuum chuck and then moves the chip on the stage by using the position control nib 17 that is moved by the driving means to position the chip.
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