发明名称 |
CERAMIC SUBSTRATE FOR SEMICONDUCTOR FABRICATING DEVICE |
摘要 |
<p>A ceramic substrate which is free from cracking or warping on heating or cooling quickly, from location-dependent variations in chucking force when the ceramic substrate constitutes an electrostatic chuck, from location-dependent variations in wafer treatment surface temperature when the ceramic substrate constitutes a hot plate, and from variations in voltage applied to guard electrodes or ground electrodes when the ceramic substrate constitutes a wafer prober to permit the removal of stray capacity or noise, and which comprises a conductive layer disposed on the surface or inside thereof, characterized in that a ratio (t2/t1) of an average conductive-layer thickness (t2) to an average ceramic-substrate thickness (t1) is less than 0.1, and variations in thickness from an average conductive-layer thickness range from 70 to +150%.</p> |
申请公布号 |
WO0182366(A1) |
申请公布日期 |
2001.11.01 |
申请号 |
WO2001JP03299 |
申请日期 |
2001.04.18 |
申请人 |
IBIDEN CO., LTD.;HIRAMATSU, YASUJI;ITO, YASUTAKA |
发明人 |
HIRAMATSU, YASUJI;ITO, YASUTAKA |
分类号 |
C04B35/00;C04B41/50;C04B41/51;C04B41/87;C04B41/88;H01L21/302;H01L21/3065;H01L21/66;H01L21/683;(IPC1-7):H01L21/68;H05B3/10;H05B3/18;H05B3/68;H05B3/16 |
主分类号 |
C04B35/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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