| 摘要 |
<p>PURPOSE: A silicon chip package and a method for manufacturing the same are provided to improve a chip mounting density per unit of a silicon substrate. CONSTITUTION: A first silicon substrate(20) comprises a plurality of silicon chips(22) and wires(26,27) A second silicon substrate(30) has same structure and oppositely formed to the first silicon substrate(20). A transmit part is connected to the first and second silicon substrates(20,30) and transmitted electrical signals applied from the leadframe(40) to the silicon chips(22,32). The transmit part includes the first metal conductor(50) connected to an I/O interconnection(27) of the first silicon substrate(20), the second metal conductor(51) connected to an I/O interconnection(37) of the second silicon substrate(30), and a solder bump(52) for bonding the first and second metal conductor.</p> |
