发明名称 Method and apparatus for bonding optical disc substrates together, and method for supplying liquid material
摘要 The object of the present invention is to significantly inhibit the formation of voids between substrates bonded together when a liquid adhesive is supplied onto an optical disc substrate or when the optical disc substrate is bonded to another optical disc substrate. Accordingly, the present invention discloses a method for bonding two optical disc substrates together which comprises the steps of joining the optical disc substrates together with an adhesive and curing the adhesive, wherein the adhesive is supplied onto the optical disc substrate by an electric field formed between the adhesive-supplying nozzle, for supplying the adhesive onto the optical disc substrate, and the optical disc substrate, and the two optical disc substrates are then joined together and subjected to spun by a spinning process.
申请公布号 US2001035250(A1) 申请公布日期 2001.11.01
申请号 US20010778232 申请日期 2001.02.06
申请人 ORIGIN ELECTRIC COMPANY, LIMITED. 发明人 SHINOHARA SHINICHI;KOBAYASHI HIDEO;NAKAMURA MASAHIRO;KAJI KANYA
分类号 B05C5/02;B29C65/04;B29C65/52;G11B7/26;(IPC1-7):B32B31/16 主分类号 B05C5/02
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