| 摘要 |
A heat-conducting base plate (3) is formed on the bottom of a power module (1). A substrate (4) and a substrate (5) are arranged on the upper surface of the base plate (3), and a semiconductor element (6) and a semiconductor element (7) are arranged on the upper surfaces of the substrate (4) and the substrate (5), respectively. The semiconductor elements (6, 7) are enclosed in a resin case (2). Using the resin case (2), a source electrode (13) is separated vertically from the semiconductor elements (6, 7). The source electrode (13) and the source of the semiconductor element (7) are connected together by wire bonding. |
