| 发明名称 |
MOLD REMOVING AGENT COMPOSITION |
| 摘要 |
PROBLEM TO BE SOLVED: To provide a mold removing agent composition exhibiting high mold removing effect. SOLUTION: The mold removing agent composition contains (A) one or more substances selected from hypochlorous acid salts and hypochlorous acid, (B) one or more substances selected from ampholytic surfactants and cationic surfactants and (C) a pH regulator.
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| 申请公布号 |
JP2001302423(A) |
申请公布日期 |
2001.10.31 |
| 申请号 |
JP20000130278 |
申请日期 |
2000.04.28 |
| 申请人 |
KAO CORP |
发明人 |
YAMAZAKI YOSHIHIRO;YOSHIKAWA KIYOAKI;OKANO TETSUYA;TAMURA SHIGERU |
| 分类号 |
A01N59/08;A01N25/30;A01N33/12;A01N33/24;(IPC1-7):A01N59/08 |
主分类号 |
A01N59/08 |
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