发明名称 EPOXY RESIN COMPOSITION, METAL FOIL WITH RESIN, AND INSULATING FILM
摘要 PROBLEM TO BE SOLVED: To obtain an epoxy resin composition scarcely causing cracking or peeling, etc., in a semicured state (B stage) and without making a resin residue remain in a cured state even when via holes are formed by carrying out perforation with laser beams. SOLUTION: This epoxy resin composition consists essentially of a novolak type epoxy resin and a cross-linked rubber having <=1μm particle diameter. The amount of the novolak type epoxy resin contained therein is 20-80 pts.mass based on 100 pts.mass of the solid content.
申请公布号 JP2001302887(A) 申请公布日期 2001.10.31
申请号 JP20000124934 申请日期 2000.04.25
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 TAMIYA HIROKI;ITO KATSUHIKO
分类号 C08J5/18;B32B15/08;B32B15/092;C08L21/00;C08L29/14;C08L63/04;H01B3/40;H01B17/56;(IPC1-7):C08L63/04 主分类号 C08J5/18
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