发明名称 |
EPOXY RESIN COMPOSITION, METAL FOIL WITH RESIN, AND INSULATING FILM |
摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition scarcely causing cracking or peeling, etc., in a semicured state (B stage) and without making a resin residue remain in a cured state even when via holes are formed by carrying out perforation with laser beams. SOLUTION: This epoxy resin composition consists essentially of a novolak type epoxy resin and a cross-linked rubber having <=1μm particle diameter. The amount of the novolak type epoxy resin contained therein is 20-80 pts.mass based on 100 pts.mass of the solid content. |
申请公布号 |
JP2001302887(A) |
申请公布日期 |
2001.10.31 |
申请号 |
JP20000124934 |
申请日期 |
2000.04.25 |
申请人 |
MATSUSHITA ELECTRIC WORKS LTD |
发明人 |
TAMIYA HIROKI;ITO KATSUHIKO |
分类号 |
C08J5/18;B32B15/08;B32B15/092;C08L21/00;C08L29/14;C08L63/04;H01B3/40;H01B17/56;(IPC1-7):C08L63/04 |
主分类号 |
C08J5/18 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|