| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating apparatus which removes adhered liquid stuck to a cathode electrode pin in contact with a wafer on plating and improves the quality of the plated wafer. SOLUTION: The plating device is provided with an adhered liquid removing means which removes the adhered liquid 11 stuck to the cathode electrode pin 6 on plating in contact with the wafer which is arranged on a wafer supporting board 5. Therein, a gas blowing pipe 8 which is disposed on a wafer retaining board 7 and blows the gas 9 for blowing to the cathode electrode pin 6 is disposed as the adhered liquid removing means. The gas blowing pipe 8 is disposed on the position where a blowout port 8a is opposing to the cathode electrode pin 6. The gas blowing pipe 8 rotates together with the cathode electrode pin 6 while blowing the gas 9 for blowing to the cathode electrode pin 6.
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