| 摘要 |
PROBLEM TO BE SOLVED: To provide a sputtering apparatus and a sputtering method having high degree of freedom of a target material without impairing the discharge stability or the mass productivity, and to provide a manufacturing method of an optical disk with reduced defects and excellent mass productivity. SOLUTION: In a target and a backing plate charged in each film deposition chamber of the sputtering apparatus having a plurality of film deposition chambers, the contours of the targets in a placed condition are common to each other, and the joining position with the backing plate is arbitrarily changed according to the thickness of the target.
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