| 摘要 |
An interconnection structure is provided which is simple in structure and is easily manufactured and in which stress generated in solder bumps is minimized. Pads 5 of a semiconductor chip 1 and pads 6 of a substrate 2 are connected to each other by solder bumps 3. The solder bumps are hourglass-shaped. Metal core members 4 are provided in the solder bumps 3, respectively. The core member 4 is constituted with a circular bottom portion 41 and a circular pin portion 42. The core member 4 is soldered to the pad 5 of the semiconductor chip 1 by solder 7. <IMAGE> |
