| 摘要 |
PROBLEM TO BE SOLVED: To obtain a polymer insulation material excellent in electric characteristics such as a dielectric constant, a dissipation factor, insulation properties, and the like, solvent resistance, heat resistance and thermal shock resistance, to provide a method for manufacturing the polymer insulation material, an electronics-related substrate and an electronic member. SOLUTION: The polymer insulation material is obtained by thermal cure of a monomer composition comprising a fumaric acid diester, a crosslinkable monomer bearing at least two carbon-carbon double bonds in one molecule and a thermally decomposable polymerization initiator. Preferably, the fumaric acid diester is the main component of the monomer composition. Desirably, the content of the thermally decomposable polymerization initiator is 0.1-10 wt.% based on the monomer composition. The electronics-related substrate such as a print wiring board, or the like, and an electronic member such as a build up material, an undercoat material, or the like, are obtained by forming a substituent material containing the polymer insulation material into a desired shape and subsequently heating it to cure. |
