发明名称 |
Electronic component with anodically bonded contact |
摘要 |
An electronic component includes an inner lead having a tip with a projection; an insulating coating that is electrically conductive when heated disposed around the projection; and a metallic coating disposed around an electrode on a semiconductor chip, with a crater reaching the electrode, the projection engaging the crater to make a contact between the inner lead and the electrode, the insulating coating and the metallic coating being anodically bonded to each other.
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申请公布号 |
US6310395(B1) |
申请公布日期 |
2001.10.30 |
申请号 |
US20000666101 |
申请日期 |
2000.09.20 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
TAKAHASHI YOSHIHARU;SHINOHARA TOSHIAKI |
分类号 |
H01L21/56;H01L21/60;H01L21/603;H01L21/607;H01L23/31;H01L23/495;(IPC1-7):H01L23/48 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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