发明名称 Laser microdissection device
摘要 The invention relates to a laser microdissection device comprised of a microscope table ( 1 ), which supports a specimen ( 3 ) to be dissected, of an incident lighting device ( 7 ), a laser light source ( 5 ) and of an objective ( 10 ) for focussing the laser beam ( 18 ) of the laser light source ( 5 ) onto the specimen ( 3 ). According to the invention, the microscope table ( 1 ) is not moved during the dissecting process. A laser scanning device ( 9 ) is arranged in the incident lighting device ( 7 ), is comprised of two thick glass wedge plates ( 11 a , 11 b), which are tilted toward the optical axis ( 8 ) and can be rotated independently of one another around said optical axis ( 8 ). In addition to the beam deviation caused by the wedge angle of the wedge plates ( 11 a, 11 b), a beam offset of the laser beam ( 18 ) is produced by the thickness and the tilt of the wedge plates ( 11 a, 11 b). When both wedge plates ( 11 a, 11 b) are rotated, the beam deviation and the beam offset of the laser beam ( 18 ) are varied in such a manner that the laser beam ( 18 ) always passes through the middle of the objective pupil ( 19 ) and, at the same time, the beam is guided over the specimen ( 3 ) to be dissected by the beam deviation of the laser beam ( 18 ).
申请公布号 AU5612901(A) 申请公布日期 2001.10.30
申请号 AU20010056129 申请日期 2001.03.29
申请人 LEICA MICROSYSTEMS WETZLAR GMBH 发明人 ALBRECHT WEISS
分类号 B23K26/00;B23K26/03;B23K26/06;B23K26/08;B23K26/082;G01N1/28;G02B21/32 主分类号 B23K26/00
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