| 摘要 |
PROBLEM TO BE SOLVED: To accurately position semiconductor devices and electronic components without using any carbon tools, to reduce mounting and wire bonding processes, and at the same time to surely achieve the fillet formation of the electronic components. SOLUTION: As shown in Figure 1, a solder flow prevention means is provided on a lead frame that is composed with an arbitrary width to form area for packaging the semiconductor devices and electronic components. The solder flow prevention means is not particularly limited in terms of structure. |
