| 摘要 |
PROBLEM TO BE SOLVED: To provide an Ni-P sputtering target used for deposition of a hard layer such as seed film for a hard disk, and its manufacturing method. SOLUTION: The Ni-P sputtering target has a structure prepared by sintering prealloyed powder composed essentially of Ni and P. Further, the maximum particle size of a powder trace phase originating from the above powder, recognized in the microstructure of the target is regulated to <=100μm and also oxygen content is regulated to <=300 ppm.
|
