| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a chip tray where dust is not liable to adhere to the circuit formation face of a mounted semiconductor chip. SOLUTION: This chip tray comprises a first part 11 which has adhesive material 13 at the topside, and a second part 12 which has a topside and a downside and has a chip mount 14 at the topside and has a hole 15 piercing itself from the chip mount to the bottom. Then, the second part 12 is mounted on the first part 11. When the semiconductor chip is placed on the chip mount of the chip tray, dust separated off the flank or the rear of the semiconductor chip falls down through the hole 15 and is caught by the adhesive material 13.</p> |
