| 摘要 |
PROBLEM TO BE SOLVED: To provide a mask where the prescribed quantity of solder paste can be printed on a wiring board and to provide the manufacturing method of the wiring board, which can form solder in a prescribed size on the wiring board. SOLUTION: In the mask 101, opening parts 103 for printing solder paste 7H are installed on a pad 5 formed on the wiring board 1. The opening part 103 corresponding to one pad 5 is the division opening part 103 constituted of a pluarity of small openings 103P and 103Q. The small opening parts 103Q at both ends in the division opening part 103 correspond to the corner 5D of the pad 5 and the periphery of the corner 5D. All small openings 103P and 103Q are the taper-like small openings extending toward a rear face 101B-side in a thickness direction.
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