| 摘要 |
PROBLEM TO BE SOLVED: To enhance connection reliability of electrode pads on a semiconductor substrate with respect to an insulating circuit board. SOLUTION: Electrode pads 1 on a semiconductor substrate 3 are mounted to face the terminal electrodes 15 on the back face trough openings 23 in an insulated circuit board 11 and connected with the terminal electrodes 15 by means of connection conductors 5 passing through the openings 23. |
