发明名称 POLISHING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a polishing technique by which the cost of consumables, such as the abrasive, polishing cloth, etc., can be suppressed by suppressing the occurrence of scratchings, peeling, dishing, and erosion without requiring any complicated cleaning process nor abrasive supplying/treating device. SOLUTION: A metallic film 21 formed on an insulating film 23 having a groove is polished with a polishing solution containing no abrasive grains, but an oxidizing substance and another substance which makes oxides water-soluble.
申请公布号 JP2001298009(A) 申请公布日期 2001.10.26
申请号 JP20010077422 申请日期 2001.03.19
申请人 HITACHI LTD 发明人 KONDO SEIICHI;HONMA YOSHIO;SAKUMA NORIYUKI;TAKEDA KENICHI;HINODE KENJI
分类号 H01L21/304;B82B1/00;(IPC1-7):H01L21/304 主分类号 H01L21/304
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