FLIP CHIP MOUNTING METHOD

摘要

A method of mounting a flip chip not allowing voids to be produced between a semiconductor chip and a substrate, comprising at least either of the steps of (A) drying the substrate, (B) (1) dispensing uncured sealant at least at a bump pressing portion on the surface of the substrate and/or the entire portion of the substrate where minute irregularities are present, and (B)(2) performing a pressing and the curing of the sealant while maintaining the temperature conditions so that a temperature difference between the semiconductor chip and the substrate does not cause a convection substantially in the uncured or curing sealant.