Interlaminar bond comprises shape memory bond applied to substrate, from polymer layer from thermoplastic polymer

摘要

The interlaminar bond comprises a shape memory bond applied to a substrate. The shape memory bond is present, depending on the temperature, in a Martensite phase and or in a Austenite phase. The interlaminar bond has at least one polymer layer from a polymer with thermoplastic properties. At a first high temperature the rigidity of the polymer is greater than that of the shape memory bond. At a second higher temperature, the rigidity of the polymer is less than that of the shape memory bond.