| 摘要 |
PURPOSE:To improve the cooling efficiency at a multilayer interconnection substrate by a method wherein an inner flow path and an outer flow path are installed as flow paths where a cooling liquid flows and a block where the multilayer interconnection substrate is mounted directly is installed in the center of the inner flow path. CONSTITUTION:An inner flow path 3 and an outer flow path 4 are installed as flow paths where a cooling liquid flows. A multilayer interconnection substrate 1 mounted on a module is fitted to a frame 2; they are formed in the center of the inner flow path 3. The cooling liquid flows through the inner flow path 3; furthermore, the cooling liquid flows through the outer flow path 4 at the outside. The cooling liquid flows is a convection current or a countercurrent. By this setup, the cooling efficiency at the multilayer interconnection substrate is improved. |
