AUTOMATED PROCESS MONITORING AND ANALYSIS SYSTEM FOR SEMICONDUCTOR PROCESSING

摘要

A method is provided for manufacturing, the method comprising processing a workpiece (100), measuring a parameter (110) characteristic of the processing, and forming an output signal (125) corresponding to the characteristic parameter (110) measured by using the characteristic parameter (110) measured as an input to a transistor model (120). The method also comprises predicting (130) a wafer electrical test (WET) resulting value (145) based on the output signal (125), detecting (150) faulty processing based on the predicted WET resulting value (145), and correcting (135, 155) the faulty processing.