发明名称 |
PHOTOSENSITIVE RESIN COMPOSITION |
摘要 |
A photosensitive resin composition which not only is excellent in various performances such as evenness, heat resistance, transparency, and chemical resistance but also is capable of easily forming a finely patterned thin film having excellent low-dielectric characteristics. The photosensitive resin composition comprises: a polymer which is obtained by reacting an alicyclic olefin polymer with a compound having an acid group or an acid derivative group to obtain an alicyclic olefin polymer containing acid groups or acid derivative groups and subsequently reacting the resultant polymer with a compound having a polymerizable unsaturated group to obtain an alicyclic olefin polymer containing polymerizable unsaturated groups and acid groups or acid derivative groups; a photopolymerization initiator; and as an optional ingredient a hardener reactive with a hydroxyl group or the acid group or acid derivative group or a crosslinking agent having a polymerizable unsaturated group.
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申请公布号 |
WO0179325(A1) |
申请公布日期 |
2001.10.25 |
申请号 |
WO2001JP03296 |
申请日期 |
2001.04.18 |
申请人 |
ZEON CORPORATION;KODEMURA, JUNJI |
发明人 |
KODEMURA, JUNJI |
分类号 |
C08F8/00;C08F255/00;C08F277/00;C08F285/00;C08G61/02;C08G61/08;C08L51/00;(IPC1-7):C08G61/08;C08F299/02;C08L65/00 |
主分类号 |
C08F8/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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