| 摘要 |
Wafer polishing apparatus (Fig 1) comprises an index unit 2 (consisting a plurality of wafer-storing cassettes (21) and robot 22), a load/unload unit 3 (with wafer transfer robots 31, 32), a washing unit 5, an electrical installation unit (6) and a polishing unit 4 (which includes two or three platens 41 and two polishing heads 42 which can be linearly moved between platens). Water washing injection ports 45 for washing away slurry from wafer 10 are positioned between platens 41. The multi-stage polishing process involves the transfer of a wafer 10 from cassettes 21 to (un)load unit 3 which in turn transfers it to polishing unit 4. In a two-step polishing procedure, wafer 10 is held by heads 42 after polishing by platens on both sides and then transferred, via waiting unit 43, to the centre platen which has different polishing characteristics. After polishing, (un)load unit 3 transfers wafer 10 to washing unit 5 before returning it cassette 21 via robot 22. |
