发明名称 ROTARY SUBSTRATE TREATMENT APPARATUS
摘要 PROBLEM TO BE SOLVED: To prevent a chemical from dripping from a chemical discharge nozzle at a low coat in a rotary substrate treatment apparatus. SOLUTION: A closing valve 21b to be opened by an application of a specified liquid pressure in a discharge direction is provided in an upstream side of the chemical discharge nozzle 21a for feeding the chemical to a surface of a substrate 10. A pressure relieving mechanism for relieving a residual pressure in the upstream side of the closing valve 21b at the time of stopping the feed of the chemical is provided in a feed system for feeding the chemical to the chemical discharge nozzle 21a.
申请公布号 JP2001293397(A) 申请公布日期 2001.10.23
申请号 JP20000111999 申请日期 2000.04.13
申请人 SUMITOMO PRECISION PROD CO LTD 发明人 FUJINE OSAMU;NAKADA KATSUTOSHI
分类号 G03F7/30;B05B1/14;B05C5/00;B05C11/08;H01L21/027;(IPC1-7):B05B1/14 主分类号 G03F7/30
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