发明名称 |
DEVICE AND METHOD FOR CLEANING SUBSTRATE |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a device and a method for cleaning a substrate, by which the substrate such as a semiconductor material, ULSI and a wafer can be cleaned with high cleaning effectiveness. SOLUTION: This substrate cleaning device has a substrate cleaning section 5 for cleaning the substrate being a subject to be cleaned by the action of a cleaning liquid on the substrate surface by jetting the cleaning liquid from a supersonic nozzle for generating a supersonic current while accelerating the speed of the cleaning liquid into supersonic one by a compressed gas and an ultraviolet irradiation section 7 for irradiating the substrate, just before or/and just after it is cleaned with the cleaning liquid, with ultraviolet rays in the atmosphere.</p> |
申请公布号 |
JP2001293443(A) |
申请公布日期 |
2001.10.23 |
申请号 |
JP20000109852 |
申请日期 |
2000.04.11 |
申请人 |
SHIMADA PHYS & CHEM IND CO LTD;FUJITSU LTD;HITACHI LTD |
发明人 |
HIRANO NAOYA;HOSHINO EIICHI;HOKO HIROSANE;OGAWA TARO |
分类号 |
B08B3/02;B08B3/10;G03F1/82;H01L21/304;(IPC1-7):B08B3/10;G03F1/08 |
主分类号 |
B08B3/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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