发明名称 DEVICE AND METHOD FOR CLEANING SUBSTRATE
摘要 <p>PROBLEM TO BE SOLVED: To provide a device and a method for cleaning a substrate, by which the substrate such as a semiconductor material, ULSI and a wafer can be cleaned with high cleaning effectiveness. SOLUTION: This substrate cleaning device has a substrate cleaning section 5 for cleaning the substrate being a subject to be cleaned by the action of a cleaning liquid on the substrate surface by jetting the cleaning liquid from a supersonic nozzle for generating a supersonic current while accelerating the speed of the cleaning liquid into supersonic one by a compressed gas and an ultraviolet irradiation section 7 for irradiating the substrate, just before or/and just after it is cleaned with the cleaning liquid, with ultraviolet rays in the atmosphere.</p>
申请公布号 JP2001293443(A) 申请公布日期 2001.10.23
申请号 JP20000109852 申请日期 2000.04.11
申请人 SHIMADA PHYS & CHEM IND CO LTD;FUJITSU LTD;HITACHI LTD 发明人 HIRANO NAOYA;HOSHINO EIICHI;HOKO HIROSANE;OGAWA TARO
分类号 B08B3/02;B08B3/10;G03F1/82;H01L21/304;(IPC1-7):B08B3/10;G03F1/08 主分类号 B08B3/02
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