| 摘要 |
Surface mounted LEDs are arrayed in special patterns to provide a relatively high resolution dot-matrix visual display and/or multi-segment character displays. Especially abbreviated solder bonding pads are utilized to obtain a higher density packing of the surface mounted arrays in at least some embodiments. Special anti-glare coatings and structures are employed to reduce ambient light reflections for aircraft instrument applications. Multi-colored display outputs are also provided.
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