发明名称
摘要 PURPOSE:To make inner leads finer without hindrance and to intensify the adhesibility of the inner leads to an etching stopper in a lead frame forming method in which a lead frame is formed by using a lead frame forming material having a three-layer structure composed of a thick Cu layer for forming outer leads and thin Cu layer for forming inner leads respectively formed on both surfaces of an Al layer which becomes the etching stopper. CONSTITUTION:A lead frame material comprises a copper base 1, which is coated by physical vapor deposition with an Al layer 2 on one side and a Cu layer 3 on the other side.
申请公布号 JP3221471(B2) 申请公布日期 2001.10.22
申请号 JP19930319038 申请日期 1993.11.25
申请人 发明人
分类号 H01L23/50;(IPC1-7):H01L23/50 主分类号 H01L23/50
代理机构 代理人
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