| 摘要 |
PROBLEM TO BE SOLVED: To surely connect a lid conductor layer covering the opening face of a through-hole and a via hole conductor layer formed on the inner surface of a via hole on a multilayer printed wiring board, having the through hole formed through a substrate and the via hole formed through an insulating layer formed on the surface side of the substrate. SOLUTION: On a multilayered printed wiring board 2, a connecting land 4 is formed, so as to completely fill a recessed part 18a at the central part on the surface of a filling layer 18. Furthermore, the surface of the connecting land 4 is planarized so as to be parallel with the surface of a substrate 10. Therefore, when forming a via hole 26 on the insulating layer 22, without leaving resin paste on the surface of the connecting land 4, the resin paste at the part to form the via hole 26 can be surely removed by exposure/development, and the connecting land 4 and a plating via hole 24 can be surely connected. |
