| 摘要 |
PURPOSE: Provided are method of electroless plating and an electroless plating apparatus for forming a barrier layer by electroless plating able to stably and uniformly form a film even when interconnections and connection holes are miniaturized and have large aspect ratios and able to reduce the consumption of a processing solution by increasing its lifetime. CONSTITUTION: A method of electroless plating for processing a plating surface to form a barrier layer being capable of uniformly forming a barrier layer and reducing the consumption of a processing solution, comprising a step of feeding a processing solution used in at least one of the pre-processing steps of the electroless plating and the electroless plating step to the plating surface for puddling treatment, or, using a processing solution at least containing, with respect to one mole of a first metallic material supplying a main ingredient of the barrier layer, three or more moles of a completing agent and three or more moles of reducing agent and having a pH value adjusted to 9 or more and stored in an atmosphere of an inert gas or ammonia gas.
|
