发明名称 |
HIGH FREQUENCY MODULE UNIT AND MOBILE COMMUNICATION UNIT USING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To prevent the thickness of a board from being increased because of a tri-plate structure having two dielectric layers and a ground layer. SOLUTION: The mobile communication unit is provided with a flexible board 1 with a dielectric layer 1a on one side, the high frequency module 3 having at least one antenna radiation means 2 provided to one side of the flexible board 1 to transmit/receive a wireless signal externally, and a generating circuit conversion means that is connected to the antenna radiation means 2 and properly converts a frequency of the wireless signal, and provided with an adhesion means 1b that adheres the flexible board 1 onto an installed face. An engagement means or a plate magnet is adopted for the adhesion means 1b.
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申请公布号 |
JP2001292025(A) |
申请公布日期 |
2001.10.19 |
申请号 |
JP20000104988 |
申请日期 |
2000.04.06 |
申请人 |
MITSUBISHI ELECTRIC CORP |
发明人 |
TANIGUCHI EIJI;HIEDA MORISHIGE;SUEMATSU KENJI;TAKAGI SUNAO;MIYAZAKI MORIYASU;CHIBA ISAMU;ISHIDA OSAMI;URASAKI SHUJI |
分类号 |
H01Q23/00;H01Q1/24;H01Q1/38;H01Q3/24;H01Q3/36;H01Q13/08;H01Q21/06;(IPC1-7):H01Q23/00 |
主分类号 |
H01Q23/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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