| 摘要 |
PROBLEM TO BE SOLVED: To provide a mount structure and a mount method by which a piezoelectric vibrator chip can easily be mounted in a package without deteriorating the performance of a piezoelectric device and to provide the piezoelectric device adopting them. SOLUTION: In the mount structure for the piezoelectric vibrator chip 11 sealed in the package 12, a mount section 33 of the package is provided with a through-hole 35 communicative to the outer side of the package to form a metallic section 36 made of a conductive metal, a metallic ball 41 made of a conductive metal is placed on the metallic section, an electrode section 31 of the piezoelectric vibrator chip 11 is placed on the metallic ball and melting the metallic ball 41 can fix the piezoelectric vibrator chip.
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