| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for designing board, a method for producing package board and a package board, with which no packaging trouble occurs by performing cream solder printing, even to the electrode of fine pitch without printing defect. SOLUTION: The method for designing board determines the location of electrodes to be formed on a board to package electronic components. The electrode of a kind forms the pattern hole of a mask plate 2 to be used for screen printing of cream solder on the electrodes inside a recessed part 2d, and the upper surface of the mask plate is removed by a prescribed thickness. An electrode is located, such that the recessed parts 2d equal to or more than two cannot exist at the same time on the lengthwise line of a squeegee 13 at the respective moving positions of the squeegee 13 at the time of screen printing. Thus, the printing defect can be prevented by securing the followup ability of the squeegee 13 into the recessed parts 2d.
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