| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having high resolution and excellent in adhesion and removability as a resist and a photosensitive film using the composition. SOLUTION: The photosensitive resin composition contains a binder component (A), a monomer component (B) and a photopolymerization initiator (C). The binder component (A) contains at least a vinyl polymer (A1) having a weight average molecular weight of 50,000-100,000 and 110-170 mgKOH/g acid value and a vinyl polymer (A2) having a weight average molecular weight of 5,000-45,000, 180-300 mgKOH/g acid value and 100-160 deg.C glass transition temperature. The photopolymerization initiator (C) contains at least a lophin dimer (C1). |
