METHOD AND TAPE FOR PEELING

摘要

PROBLEM TO BE SOLVED: To provide a peeling method in which a substance can be prevented from breakage which is generated when the substance is peeled from a fixing tape for fixing the substance at such a machining duration as a back grind step or a dicing step for a semiconductor wafer. SOLUTION: This peeling method has a feature of suctioning (reducing a pressure) from other surface of a tape for peeling when a machining substance is attached with the tape for peeling, especially porous member is preferably used as the tape for peeling and the machining substance is attached, at the time of peeling the machining substance from a fixing tape for machining.