发明名称 CONNECTOR FOR SUBSTRATE CONNECTION
摘要 <p>PROBLEM TO BE SOLVED: To enable to mount, retain, and fix a printed-circuit board easily without buckling or deforming of a contact. SOLUTION: An insulator 100 is given a structure equipped with substrate mounting part 110 formed in a step-form in which it is connected with a bottom surface 111, a sidewall 112, an upper face 113, where the sidewall 112 has a thickness size similar to the plate thickness of a printed-circuit board 600, and plural contact main slide retaining parts 120 which are installed in back to back to the part 110. Each of plural contract 200 is formed to have a shape to have a contact part 210 in one end, a retaining part 230 connected to the contact part 210 and folded in U-shaped and extended in a straight line, and a connection part 220 connected to the retaining part 230. The contact part 210 of the contact 200 is press contacted to the upper face 113 of the insulator 100 and is stopped once, and in this state, the printed-circuit board 600 is mounted and the contact 200 is sliding inserted to the last deployment position, and the printed-circuit board is retained, fixed and connected.</p>
申请公布号 JP2001291542(A) 申请公布日期 2001.10.19
申请号 JP20000106317 申请日期 2000.04.07
申请人 YAMAGATA KOKU DENSHI KK 发明人 WADA KOICHI
分类号 H01R4/48;H01R12/28;(IPC1-7):H01R12/18;H01R12/16;H01R12/22 主分类号 H01R4/48
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