METHOD FOR CONTROLLING SURFACE TEMPERATURE OF WAFER

摘要

PURPOSE: A control method of a surface temperature of a wafer is provided to improve a uniformity of the whole wafer surface temperature by a heating plate. CONSTITUTION: A heating plate(200) is divided by a plurality of point cell units. Each point cell units have a thermocouple semiconductor. A wafer is then loaded on the heating plate(200). A point cell region(210b) having locally low temperature is applied to a positive bias, thereby increasing the surface temperature of the wafer. Also, a point cell region(210c) having locally high temperature is applied to a negative bias, thereby decreasing the surface temperature of the wafer.