发明名称 A METHOD OF DETERMINING THE END POINT OF A PLASMA CLEANING OPERATION
摘要 <p>A method of determining an end point for a remote microwave plasma cleaning system. In one embodiment, the method comprises several steps. The first step is to expose an electrical device to a deposition operation. Next, the electrical device is exposed to a plasma cleaning operation. In the following step, a value for a performance characteristic of the electrical device is measured. In the last step, an amount of cleaning performed on the electrical device is calculated based on a relationship between a baseline value of the performance characteristic and on the measured value of the performance characteristic of the electrical device.</p>
申请公布号 WO2001077406(A2) 申请公布日期 2001.10.18
申请号 US2001010553 申请日期 2001.03.29
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