| 摘要 |
<p>A process for applying an adhesive panel to a substrate including the steps of:- providing a die including two operatively linked die parts each having a die cavity;- lowering the die to punch a panel of adhesive out of a strip of adhesive and into the die cavity of one die part;- rotating the die to transfer the panel of adhesive which is retained in the die cavity to a substrate;- lowering the die and applying heat and pressure to adhere the adhesive panel to the substrate, whilst at the same time punching a panel of adhesive out of the strip of adhesive with the other of the die parts; and- transferring the substrate having the adhesive panel bonded thereto to a rolling station where a roller is passed transversely across the surface of the adhesive to taper the edges of the adhesive panel so as to create a domed upper surface of the adhesive panel.</p> |
