| 发明名称 |
COPPER-CLAD LAMINATED SHEET |
| 摘要 |
<p>A copper-clad laminated sheet hole-drilled by laser and using electrolytic copper foil, the rough surface of the copper foil being used as a laser entry surface. A copper-clad laminated sheet, easy to hole-drill by laser and suitable for forming small-diameter, interlayer connection holes, is provided by improving the surface of the copper foil used as a laser entry surface when producing a printed circuit board.</p> |
| 申请公布号 |
WO0178473(A1) |
申请公布日期 |
2001.10.18 |
| 申请号 |
WO2001JP02707 |
申请日期 |
2001.03.30 |
| 申请人 |
NIKKO MATERIALS COMPANY, LIMITED;SAKAMOTO, MASARU;KITANO, KOUJI |
发明人 |
SAKAMOTO, MASARU;KITANO, KOUJI |
| 分类号 |
B23K26/00;B23K26/38;B23K101/42;C25D7/06;H05K1/09;H05K3/00;H05K3/38;(IPC1-7):H05K3/00;B32B15/08 |
主分类号 |
B23K26/00 |
| 代理机构 |
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代理人 |
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