发明名称 Plasma treatment method and apparatus
摘要 A plasma treatment apparatus and method are disclosed. The plasma treatment apparatus has a discharge unit with at least one discharge electrode assembly disposed on a generally rectangular-shaped housing in a position that is offset from being coaxial with a longitudinal axis of the discharge unit housing. A plurality of discharge units can be arranged side by side so that their discharge electrodes are alternately disposed with respect to one another in order to treat a wide work surfaces that are wider than the distance between discharge electrodes.
申请公布号 US2001030025(A1) 申请公布日期 2001.10.18
申请号 US20010833819 申请日期 2001.04.13
申请人 FUJITA TSUKASA 发明人 FUJITA TSUKASA
分类号 H05H1/24;B01J19/08;C23F4/00;H01J37/32;(IPC1-7):H05H1/24 主分类号 H05H1/24
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